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Advanced Materials and Processing IV

Advanced Materials Research Volumes 29 - 30

• Papers
• Abstracts

• p-2 Committees and Sponsors   [ 28 K ]
• p0 Preface   [ 13 K ]
• p3 Overview of Current International Magnesium Research and Recent CAST CRC Developments   [ 1 M ]
  Authors: David StJohn
• p9 Advanced Wood- and Bio-Composites: Enhanced Performance and Sustainability   [ 174 K ]
  Authors: Jerrold E. Winandy
• p15 New Ceramic Membrane Materials for Gas Purification   [ 4 M ]
  Authors: Ian W.M. Brown, M.E. Bowden, T. Kemmitt, A. Kirchner, Kenneth MacKenzie
• p21 A Ductile UFG Al Alloy via Cryomilling and Quasi-Isostatic Forging   [ 1 M ]
  Authors: A.P. Newbery, Byung Ahn, P. Pao, S.R. Nutt, Enrique J. Lavernia
• p33 Compaction of Ti-6Al-4V Powder by ECAE with Back-Pressure   [ 319 K ]
  Authors: Rimma Lapovok, Dacian Tomus, Barry C. Muddle
• p37 Optimising the Model of Gas-Jet Quenching of a Carburised Gear   [ 741 K ]
  Authors: Paul Stratton
• p43 Metallurgical Nature at the Interface between Tool Shoulder and Workpiece during Friction Stir Welding   [ 3 M ]
  Authors: Zhan W. Chen, T. Pasang, Q. Yin, R. Peris
• p47 Multifarious Fracture Features of CuZrAlGd(Ag) Bulk Metallic Glasses   [ 15 M ]
  Authors: H.M. Fu, H.F. Zhang, H. Wang, Ming Xing Zhang, Zhuang Qi Hu
• p51 Biomechanical and Biocorrosion Properties of Nanostructured Titanium   [ 411 K ]
  Authors: X.N. Zhang
• p55 Characterization of Indentation Size Effect of Hardness Using a Loading Curve from Crystalline Materials   [ 143 K ]
  Authors: Y.L. Chiu, W. George Ferguson
• p59 The Effect of Additives and Substrate Conditions on the Copper Electrodeposition for Thin Film Applications   [ 4 M ]
  Authors: T.G. Woo, Kyeong Won Seol, Il Song Park, H.W. Lee, K.N. Woo, W.Y. Jeon
• p63 Surface Characteristics of the Anodized and Hydrothermally Treated Titanium Affected by the Current Density, Voltage, and Time   [ 6 M ]
  Authors: Il Song Park, T.G. Woo, Min Ho Lee, Tae Sung Bae, Kyeong Won Seol
• p67 Surface Characterization of an Extruded 6060 Al Alloy   [ 161 K ]
  Authors: Wei Zhang, Jim Metson, C.L. Nguyen, S. Chen