Sonoelectroplating of Sn - Bi Solder Film from EDTA Bath |
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| Journal | Advanced Materials Research (Volumes 29 - 30) |
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| Volume | Advanced Materials and Processing IV |
| Edited by | Deliang Zhang, Kim Pickering, Brian Gabbitas, Peng Cao, Alan Langdon, Rob Torrens and Johan Verbeek |
| Pages | 99-102 |
| DOI | 10.4028/www.scientific.net/AMR.29-30.99 |
| Citation | Atsushi Chiba et al., 2007, Advanced Materials Research, 29-30, 99 |
| Online since | November, 2007 |
| Authors | Atsushi Chiba, T. Kojima, Wen Chang Wu |
| Keywords | EDTA Bath, Electroplating, Sn-Bi Solder, Ultrasonic Agitation |
| Abstract | This study concerns the development of Pb free solder plating due to environmental concerns. The composition of the bath was 0.1 mol/dm3 SnY and 0.1 mol/dm3 BiY- in 2 mol/dm3 CH3COOH - 2 mol/dm3 CH3COONa buffer solution (pH 4.0). The bath used 100 cm3 of solution. Plating was carried out at a current density of 50 mA/cm2 using ultrasonic agitation (sonication) at 28 kHz (100 W). Various percentages of a Sn - Bi alloy could be plated. A 41wt.%Sn - 59 wt.%Bi alloy with a melting point of 415 K was obtained from a [BiY-]/[BiY-+SnY] = 0.3 bath. The surface morphologies of the plated films showed a striking difference in accordance with a change of composition. |
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