Paper Title:
Via Structure Optimized Design and Study of Copper Interconnect
  Abstract

Electromigration(EM) failure can be occurred in the via because of the high aspect ratio of Via and the high stress in the via. The theoretical and experimental study is developed in detail. The different via structures are designed and the simulation and accelerate test is operated. The result shows the current density and electric field in the via is decreased apparently and reliability is improved by use the structures, so it is considered of the practical means for improving the copper via interconnect reliability. Finally, two optimized via structures are advanced based on the result of experiments and simulations. The two structures are instructive for the design and manufacture.

  Info
Periodical
Advanced Materials Research (Volumes 291-294)
Chapter
Other related topics
Edited by
Yungang Li, Pengcheng Wang, Liqun Ai, Xiaoming Sang and Jinglong Bu
Pages
3445-3448
DOI
10.4028/www.scientific.net/AMR.291-294.3445
Citation
M. Du, R. Zhang, "Via Structure Optimized Design and Study of Copper Interconnect", Advanced Materials Research, Vols. 291-294, pp. 3445-3448, 2011
Online since
July 2011
Authors
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Price
$32.00
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