Packaging material of electronic goods requires higher strength, higher reliability, and lower expansion coefficient .What’s more, forming process is important. The Fe-Ni-Co alloy has a low expansion coefficient and good structure stability, so it is often used for packaging materials for the semiconductor industry. The shape of electronic packaging parts is so complex that the traditional manufacturing processes are difficult to form and it costs more, which greatly limits the application of Fe-Ni-Co alloy in complex electronic packaging parts. Metal (ceramic) powder injection molding (MIM / CIM) is a new near net shape technology. In this paper, we analyze the structures and characteristics of Gehause which is an electronic packaging box that has been successfully used in the MIM process to produce it. In this process, we adopted a new material of Fe-Ni-Co alloy, a specia binder and SPC (Statistical Process Control) technology which control parameters of injection molding and weight of parts. After sintering, the mechanical properties and precision of finished products meet all demands. Therefore, MIM technology can greatly improve the production efficiency, save materials and reduce production costs in producing Gehause.