Paper Title:
Fabrication of SiCp/Cu Composite by Powder Injection Molding
  Abstract

A SiCp/Cu composite with excellent performance is prepared by using the advanced powder injection molding technology. The microhardness and tensile strength of the composite are detected, and the surface microstructure and the tensile fractures are observed. The results show that SiC particles are uniformly distributed in Cu matrix and excellently bonded with the Cu matrix. With the increase of the SiC content, the microhardness of the composite is increased while the tensile strength is increased first and then decreased. A crackle source of the composite for tensile fracture mainly includes two kinds: cracking of the Cu matrix in vicinity of the SiC particles and debonding of an interface of the SiC particles and the Cu matrix.

  Info
Periodical
Advanced Materials Research (Volumes 291-294)
Chapter
Materials Machining
Edited by
Yungang Li, Pengcheng Wang, Liqun Ai, Xiaoming Sang and Jinglong Bu
Pages
721-724
DOI
10.4028/www.scientific.net/AMR.291-294.721
Citation
J. M. Yang, H. Q. Li, H. Chen, Y. Q. He, L. C. Feng, "Fabrication of SiCp/Cu Composite by Powder Injection Molding", Advanced Materials Research, Vols. 291-294, pp. 721-724, 2011
Online since
July 2011
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Price
$32.00
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