Paper Title:
The Effect of Nano-Cu Particles on Mechanical Properties of Micro-Joining Joint with Lead-Free Solder
  Abstract

The effect of nano-Cu particles on mechanical bend reliability of micro-joining joint with Sn-3.5Ag lead free solder was studied in this paper. The results show that 0.5% nano-Cu composite lead free solder show significantly better shearing strength and mechanical bend fatigue properties than eutectic Sn-3.5Ag solder paste, 1.0% nano-Cu composites and 1.5% nano-Cu composites. The further analysis shows that adding nano-Cu particles make much effect on intermetallic (IMC) in the interface of micro-joint and the inside of the solder joint. The different interface of micro-joining joint induced different mechanical properties.

  Info
Periodical
Advanced Materials Research (Volumes 291-294)
Chapter
Welding & Joining
Edited by
Yungang Li, Pengcheng Wang, Liqun Ai, Xiaoming Sang and Jinglong Bu
Pages
929-933
DOI
10.4028/www.scientific.net/AMR.291-294.929
Citation
Y. M. Shen, F. J. Qi, M. Xie, J. Li, "The Effect of Nano-Cu Particles on Mechanical Properties of Micro-Joining Joint with Lead-Free Solder", Advanced Materials Research, Vols. 291-294, pp. 929-933, 2011
Online since
July 2011
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Price
$32.00
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