Experimental Study of the Packaging Failure for Optical Fiber Arrays
| Periodical | Advanced Materials Research (Volumes 295 - 297) |
|---|---|
| Main Theme | Manufacturing Science and Technology |
| Edited by | Pengcheng Wang, Liqun Ai, Yungang Li, Xiaoming Sang and Jinglong Bu |
| Pages | 1594-1599 |
| DOI | 10.4028/www.scientific.net/AMR.295-297.1594 |
| Citation | Ji An Duan et al., 2011, Advanced Materials Research, 295-297, 1594 |
| Online since | July, 2011 |
| Authors | Ji An Duan, Yu Zheng |
| Keywords | Adhesive, Assembly, Experimental Observation, Failure, Optical Fiber Array |
| Price | US$ 28,- |
Optical fiber array is a key component in the assembly of planar optical waveguide devices and enable greater channel counts than previously. However, assembling optical fiber array has been a challenge due to the stringent performance and reliability requirements posed by optical fiber communication applications. This paper investigates the causes of the failures involving the adhesive including: surface contamination, air entrapment, uneven curing, curing shrinkage; and thermal expansion coefficient mismatch.