Paper Title:

Experimental Study of the Packaging Failure for Optical Fiber Arrays

Periodical Advanced Materials Research (Volumes 295 - 297)
Main Theme Manufacturing Science and Technology
Edited by Pengcheng Wang, Liqun Ai, Yungang Li, Xiaoming Sang and Jinglong Bu
Pages 1594-1599
DOI 10.4028/www.scientific.net/AMR.295-297.1594
Citation Ji An Duan et al., 2011, Advanced Materials Research, 295-297, 1594
Online since July, 2011
Authors Ji An Duan, Yu Zheng
Keywords Adhesive, Assembly, Experimental Observation, Failure, Optical Fiber Array
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Abstract

Optical fiber array is a key component in the assembly of planar optical waveguide devices and enable greater channel counts than previously. However, assembling optical fiber array has been a challenge due to the stringent performance and reliability requirements posed by optical fiber communication applications. This paper investigates the causes of the failures involving the adhesive including: surface contamination, air entrapment, uneven curing, curing shrinkage; and thermal expansion coefficient mismatch.