Paper Title:
The Thermal and Di-Electric Properties of a Silicone-Based Thermal Pad
  Abstract

The properties of a silicone-based elastomeric thermal pad filled with inexpensive ceramic additives were studied in this research. The effects of the content, particle size and mixing ratio of two additives upon the thermal and di-electrical property of the thermal pad are investigated. The result shows that the higher the content, the higher the thermal and dielectric properties are. In addition, the thermal conductivity of two particles filled thermal pads are higher than that of a single particle filled thermal pad. The thermal conductivity of the two kind of particle sizes (14 and 2 um) of 60 % (vol.) SiC filled thermal pad is the highest (2.14 W/m·K).

  Info
Periodical
Advanced Materials Research (Volumes 295-297)
Chapter
Chapter 1: Materials Properties
Edited by
Pengcheng Wang, Liqun Ai, Yungang Li, Xiaoming Sang and Jinglong Bu
Pages
804-807
DOI
10.4028/www.scientific.net/AMR.295-297.804
Citation
W. S. Jou, C. F. Hsu, Y. K. Yeh, "The Thermal and Di-Electric Properties of a Silicone-Based Thermal Pad", Advanced Materials Research, Vols. 295-297, pp. 804-807, 2011
Online since
July 2011
Export
Price
$32.00
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