Paper Title:
Research on a New Type of Ultrasonic Polishing Vibrator
  Abstract

Aiming at the ultrasonic vibration polishing technology of silicon wafer, this paper proposes a disc-shaped ultrasonic piezoelectric polishing vibrator of out-of-plant bending travalling wave. Basing on numerical analysis, the principle prototype of the polishing vibrator has been designed and produced, and then tested. This polishing vibrator can be used in polishing process of semiconductor silicon wafer.

  Info
Periodical
Advanced Materials Research (Volumes 299-300)
Edited by
Jianzhong Wang and Jingang Qi
Pages
1132-1135
DOI
10.4028/www.scientific.net/AMR.299-300.1132
Citation
Q. He, Y. H. Li, K. Jia, L. Li, "Research on a New Type of Ultrasonic Polishing Vibrator", Advanced Materials Research, Vols. 299-300, pp. 1132-1135, 2011
Online since
July 2011
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Price
$32.00
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