Paper Title:
Study on Bonding Wire Breakage Detection Using Diffraction of Light
  Abstract

In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip. With increasing demand of tiny wires, current detection apparatus encounters some limitations. In this paper, a method to detect breakage of tiny bonding wires using diffraction of light is proposed. A laser head generates the light beam, and a slit is introduced in the path of light source, so the slot generates diffraction pattern, and light irradiance loss at the receiver due to the presence of a wire could be observed. Simulation results show that the proposed method with a slit design renders satisfactory detection sensitivity for tiny wires.

  Info
Periodical
Advanced Materials Research (Volumes 301-303)
Chapter
Chapter 2: Measuring and Testing Techniques
Edited by
Riza Esa and Yanwen Wu
Pages
553-558
DOI
10.4028/www.scientific.net/AMR.301-303.553
Citation
X. Y. Wang, Y. Xiao, X. Y. Ge, J. N. Sun, "Study on Bonding Wire Breakage Detection Using Diffraction of Light", Advanced Materials Research, Vols. 301-303, pp. 553-558, 2011
Online since
July 2011
Export
Price
$32.00
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