Paper Title:
Make Use of FPGA to Carry Out Ultrasonic Wave High Definition Nondestructive Thickness Measurement
  Abstract

This paper discussed the principle of the Nondestructive Thickness Measurement creation of the ultrasonic wave high definition and analyzed the reason that the ultrasonic wave measures a thick accuracy decision factor and error creation. Discussed to make use of FPGA to carry out the error of ultrasonic wave high definition in the common MCU is smaller than a 0.1 mm Nondestructive Thickness Measurement technique principle and carry out a method, kept to get application and realization in the gas well examination in 863 item CNGs.

  Info
Periodical
Edited by
Jerry Tian
Pages
371-375
DOI
10.4028/www.scientific.net/AMR.304.371
Citation
W. J. Yang, "Make Use of FPGA to Carry Out Ultrasonic Wave High Definition Nondestructive Thickness Measurement", Advanced Materials Research, Vol. 304, pp. 371-375, 2011
Online since
July 2011
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