Paper Title:
Finite Element Modeling of Polymer Flow during Hot Embossing with Different Mold Structures and Embossing Conditions
  Abstract

The geometric structures of the mold and embossing conditions can obviously influence the filling flows in the polymeric patterns. In this study, embossing stamp and substrate with different geometries are used to investigate the flow behavior under both isothermal and non-isothermal conditions. In general, for the stamp, small duty ratio cavity fills more sufficiently than large duty ratio cavity. With the same cavity duty ratio, inner cavity fills more quickly and sufficient than outer cavity. Compared to multiple cavities stamp, individual cavity fills more slowly, especially embossed with the stamp having small duty ratio cavity. Under non-isothermal embossing, the filling flow indicates a wall climbing flow and the polymer flow replaces the outer cavity better. Uncommon substrate provides a limitation of out-squeezing flow from polymer layers, so the polymer pick reaches the mold faster than common substrate like the flat. The present simulation study provides an analysis of the mold geometry especially the substrate geometry to govern filling flow and replication fidelity.

  Info
Periodical
Edited by
Guanglin Wang, Huifeng Wang, Jun Liu and Xilin Zhu
Pages
144-148
DOI
10.4028/www.scientific.net/AMR.305.144
Citation
T. Zhang, Y. He, J. Z. Fu, "Finite Element Modeling of Polymer Flow during Hot Embossing with Different Mold Structures and Embossing Conditions", Advanced Materials Research, Vol. 305, pp. 144-148, 2011
Online since
July 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Hong Yan, Zhi Hu, Ti Shuan Suan
Abstract:The technology of computer numerical simulation on casting process is an important frontal field of material science and technology. The...
1041
Authors: Jin Tang Shang, Jun Wen Liu, Di Zhang, Bo Yin Chen, Chao Xu, Xin Hu Luo, Hui Yu, Jing Dong Liu, Qin Gan Huang, Jie Ying Tang, Ming Qin
Abstract:Many MEMS devices including accelerometer and gyroscopes, having moving parts, requires hermetic and low cost packaging. In this paper we...
23
Authors: Philipp Frey, Martina Heinle, Christoph Leisen, Dietmar Drummer, Marion Merklein
Chapter 2: Forming
Abstract:Due to the increasing number of electronics in several industrial sectors, especially in the automotive industry, there is a rising demand...
99