Paper Title:
Influence of Electroless Copper Deposition on the Electrochemical Performance of Si/MCMB
  Abstract

Si-Cu alloys have been prepared by electroless depositions with different process. Si-Cu/MCMB materials have been prepared by carbonization of the mixture of Si-Cu, MCMB and mesophase pitch. The influences of electroless deposition condition and heat-treatment temperature on the anodic performance of Cu-Si/MCMB have been studied. Compared with Si/MCMB, Si-Cu/MCMB has more stable cyclical performance. Furthermore, the Si-Cu/MCMB sample produced by cleaning and then electroless deposition on Si shows the better anodic performance than the Si-Cu/MCMB sample produced by direct electroless deposition on Si, because the former sample has more Cu contents than the latter sample.

  Info
Periodical
Advanced Materials Research (Volumes 306-307)
Chapter
Chapter 3: Optical and Electronic Materials
Edited by
Shiquan Liu and Min Zuo
Pages
336-339
DOI
10.4028/www.scientific.net/AMR.306-307.336
Citation
M. Yan, W. Q. Gao, R. S. Xue, J. H. Yu, "Influence of Electroless Copper Deposition on the Electrochemical Performance of Si/MCMB", Advanced Materials Research, Vols. 306-307, pp. 336-339, 2011
Online since
August 2011
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Price
$32.00
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