Paper Title:
Thermal Analysis of High-Power LED Tube Lamp
  Abstract

Heat dissipation of high-power LED lamps has become a key technology to LED package due to the improvement of the LED output power. A detailed simulation of temperature distribution of three chips high-power LED tube lamp was made by finite element method. Based on the consistency of the LED lamp experimental and simulation results, the analyses of the effect of thermal conductivities of PCB, thermal grease, heat sink, convection coefficients and the length of the lamp on the junction temperature were made, which provide an effective reference for the thermal design.

  Info
Periodical
Advanced Materials Research (Volumes 308-310)
Chapter
Innovative Design Methodology
Edited by
Jian Gao
Pages
346-350
DOI
10.4028/www.scientific.net/AMR.308-310.346
Citation
X. J. Ma, L. G. Wu, S. X. Dai, B. Y. Zhou, K. Bai, Z. Y. Zheng, "Thermal Analysis of High-Power LED Tube Lamp", Advanced Materials Research, Vols. 308-310, pp. 346-350, 2011
Online since
August 2011
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Price
$32.00
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