Paper Title:
Microstructure and Nanoindentation Hardness of Sputter Deposited Nanocrystalline Tantalum Thin Films
  Abstract

Tantalum (Ta) thin film was deposited onto Si (100) substrates using direct-current magnetron sputtering. The structure and mechanical properties of Ta films were investigated by X-ray diffraction, Field emission scanning electron microscope, and nanoindenter. The results indicated a transition from regular to irregular Hall-Petch relationship with decreasing grain size. Besides, a peak indentation hardness value of 12.8 GPa, much higher than that of bulk coarse-grained Ta, was obtained at the grain size of 36.3 nm.

  Info
Periodical
Advanced Materials Research (Volumes 311-313)
Chapter
Thin Films
Edited by
Zhongning Guo
Pages
1810-1813
DOI
10.4028/www.scientific.net/AMR.311-313.1810
Citation
H. L. Sun, M. Wei, "Microstructure and Nanoindentation Hardness of Sputter Deposited Nanocrystalline Tantalum Thin Films", Advanced Materials Research, Vols. 311-313, pp. 1810-1813, 2011
Online since
August 2011
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Price
$32.00
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