Paper Title:
Stress Migration Induced Formation of Voids / Hillocks in Tungsten Films
  Abstract

Stress migration behaviors in Tungsten (W) films were investigated according to morphological characteristics and residual stress analysis. Results show that stress relaxtion induced formation of voids and hillocks strips, which resembles the void / hillock pair observed in Cu film electromigration experiments. Analysis indicate that the formation of chocolate sphere shaped W hillocks is intimately related to the atoms diffusivity.

  Info
Periodical
Advanced Materials Research (Volumes 311-313)
Chapter
Thin Films
Edited by
Zhongning Guo
Pages
1831-1834
DOI
10.4028/www.scientific.net/AMR.311-313.1831
Citation
H. L. Sun, M. Wei, "Stress Migration Induced Formation of Voids / Hillocks in Tungsten Films", Advanced Materials Research, Vols. 311-313, pp. 1831-1834, 2011
Online since
August 2011
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Price
$32.00
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