Paper Title:
Effects of Different Solder Alloys on Reliability of 3D PLUS Solder Joint
  Abstract

Thermal cycling was applied to assess the effect of tin-lead solder 63Sn37Pb and lead-free solder 95.5Sn3.8Ag0.7Cu on the reliability of 3D PLUS solder joints. Nonlinear finite element method and viscoplastic Anand model were used to evaluate the stress and strain distribution and dangerous position of solders under the thermal cycling condition. The law of solder joints stress and plastic strain were finally obtained and showed significant cyclical changes. The stress and strain emerged the trend of accumulated enhancement with the process of time, then ultimately stabilized. Comparing two curves of equivalent stress and plastic strain obtained from lead-free and tin-lead solder, it was found that the reliability of 95.5Sn3.8Ag0.7Cu was better than that of 63Sn37Pb.

  Info
Periodical
Advanced Materials Research (Volumes 314-316)
Chapter
Mechanical Behavior & Fracture
Edited by
Jian Gao
Pages
1038-1042
DOI
10.4028/www.scientific.net/AMR.314-316.1038
Citation
N. Bao, C. J. Wang, L. Zhu, S. G. Song, "Effects of Different Solder Alloys on Reliability of 3D PLUS Solder Joint", Advanced Materials Research, Vols. 314-316, pp. 1038-1042, 2011
Online since
August 2011
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Price
$32.00
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