Paper Title:
Preparation of Water-Based No-Clean Flux for High Temperature Lead-Free Solder
  Abstract

A series of water-based no-clean fluxes composed of an anion/nonion binary surfactant were investigated. The wetting behavior of Sn0.7Cu and Sn3.0Ag0.5Cu on copper with different content of binary surfactant, and the performance of the flux were tested according to the Chinese industry standard of SJ/T 11273-2002 (No-clean liquid Flux). The results showed that the wettability of binary complex was better than that of single surfactant. Two promising fluxes for Sn0.7Cu and Sn3.0Ag0.5Cu solder were selected, respectively. The fluxes showed excellent performance such as halogen-free, less corrosivity, low content of volatile organic compound (less than 5%), high spread rate (over 80%), and high surface insulation resistance (beyond 108Ω). The prepared fluxes meet the requirement of lead-free solder.

  Info
Periodical
Advanced Materials Research (Volumes 314-316)
Chapter
Mechanical Behavior & Fracture
Edited by
Jian Gao
Pages
1112-1116
DOI
10.4028/www.scientific.net/AMR.314-316.1112
Citation
Z. F. Hao, Q. Q. Wu, M. Sun, J. Yu, Y. P. Guo, Y. Rao, "Preparation of Water-Based No-Clean Flux for High Temperature Lead-Free Solder", Advanced Materials Research, Vols. 314-316, pp. 1112-1116, 2011
Online since
August 2011
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Price
$32.00
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