Paper Title:
A Novel Silicon-Based Packaging Platform for High-Efficiency LED Modules
  Abstract

A novel silicon-based packaging platform with the electroplated-based reflector and the electrode- guided interconnections is developed for the packaging component of a high-luminosity and high-efficiency multi-chip light-emitting diode (LED) module, which is patterned on a new type of insulating layer that consists of nanoporous anodized aluminum oxide (AAO) layer and plasma- enhanced chemical vapor deposition (PECVD) deposited silicon dioxide (SiO2) on a doped silicon substrate. The reflector and the electrical interconnections are successfully fabricated by using the electroplating method in the same body. In order to obtain the benefits of high efficiency LED modules, the requirements concerning thermal management and photomechanical layout have to be met. In this paper, we will discuss a novel fabrication method in LED module packaging platform, and then describe the thin layer of electroplated Cu/Ni/Au in order to reduce thermal resistance and to increase thermal diffusion efficiency. The heat generated by the LED chips is dissipated directly to the silicon body through the metal-plated platform, and truly excellent heat dissipation characteristics are observed. We demonstrate 987 lm 8 W-level cool-white light (5000 K, 16 V, 110 lm/W, CRI = 77) emission for 570 µm × 230 µm-chip LEDs at 600 mA operation.

  Info
Periodical
Advanced Materials Research (Volumes 314-316)
Chapter
Modeling, Analysis and Simulation of Manufacturing Processes
Edited by
Jian Gao
Pages
359-363
DOI
10.4028/www.scientific.net/AMR.314-316.359
Citation
C. Wang, W. S. Lee, N. Y. Kim, "A Novel Silicon-Based Packaging Platform for High-Efficiency LED Modules", Advanced Materials Research, Vols. 314-316, pp. 359-363, 2011
Online since
August 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Guo Tao Ren, Kai Lin Pan, Wei Tao Zhu, Jiao Pin Wang, Jing Huang
Abstract:Thermal contact resistance is one of key technologies for heat transfer of high power light emitting diodes (LED) packaging. In this paper,...
1477
Authors: Lue Zhang, Hong Hu, Yong Cao
Abstract:Ink marking is a key process for die sorting of IC wafer manufacturing. Intensive production of wafer is urging the inkers for more rapid and...
1713
Authors: Lei Wu, Xiao Yun Xiong, De Xing Wang
Chapter 16: Semiconductor Materials Manufacturing
Abstract:In this study, the junction temperature (Tj) and thermal resistance (Rth) of five high-power multi-chip COB...
1332
Authors: A Qiang Sun
Chapter 13: Products Design
Abstract:The cigarette packaging material is an important material, a thin flexible, fibrous web consisting of cellulose fibers deposited upon each...
2048