Paper Title:
Development of Measurement and Control System for TLP Bonding
  Abstract

The key to accomplish transient liquid phase bonding in the atmosphere is to control bonding temperature, holding time and compressive pressure. The measurement and control system was independently developed based on an industrial computer and I/O cards. The output of a medium frequency power supply and the opening degree of a proportional relief valve were regulated to control bonding temperature and compressive pressure. Improved PID algorithm was presented, and the temperature precision in steady stage reached ± 0.1%. The system is applied to TLP bond steel pipes successfully.

  Info
Periodical
Advanced Materials Research (Volumes 317-319)
Chapter
Measure Control Technologies and Intelligent Systems
Edited by
Xin Chen
Pages
1362-1367
DOI
10.4028/www.scientific.net/AMR.317-319.1362
Citation
H. Wang, Q. Yan, X. G. Li, X. G. Wang, X. M. Wang, F. J. Yan, "Development of Measurement and Control System for TLP Bonding", Advanced Materials Research, Vols. 317-319, pp. 1362-1367, 2011
Online since
August 2011
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Price
$32.00
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