Paper Title
Page
Authors: Dong Fang Ma, Gao Tao Deng, Da Nian Chen, Shan Xing Wu, Huan Ran Wang
Micro-Electronic Packaging Technology and Equipment
Abstract:The multi-tension loading in the optimized tensile split Hopkinson bar tests for pure copper sheets was used to investigating growth and...
1717
Authors: Yu Qiang Sun, Mei Weng, Cheng Xian Shi, Jing You, Qi Wei He
Micro-Electronic Packaging Technology and Equipment
Abstract:In virtue of fuzzy matrix and fuzzy linear transformation, not only the fuzzy comprehensive ability’s quantitative value is got, but also...
1725
Authors: Yan Fang Wang, Zhi Gang Zhou, Hong Mei Gao
Micro-Electronic Packaging Technology and Equipment
Abstract:In this paper, the flexible modeling capabilities of ANSYS and the excellent nonlinear solving ability of ABAQUS were multiplied for...
1729
Authors: Jing Xu, R. Jiang, Hao Zhou
Micro-Electronic Packaging Technology and Equipment
Abstract:A steel mill uses four functionally identical heavy vehicles manufactured by two different manufacturers. The information of failure time and...
1733
Authors: Guang Lin He, He Fei Tian
Micro-Electronic Packaging Technology and Equipment
Abstract:Focusing on the requirements of safety and reliability of fuze setback arming device of rocket-assisted projectile, a zigzag groove setback...
1739
Authors: Jian Hong Li, Guang Zhen Li
Micro-Electronic Packaging Technology and Equipment
Abstract:This paper investigates the network security problem which is complex to evaluate. The key of this evaluation is to establish the factors and...
1745
Authors: Yu Fang Tang, Hong Hu Zeng, Chang Wen Lei, Di Na Tan, Bao Liang Wang, Yan Hong Li, Zong Qiang Zhu, Yan Peng Liang
Micro-Electronic Packaging Technology and Equipment
Abstract:With the development of the simulative theory and calculation method of drainage pipe network, urban drainage pipe network model gradually...
1749
Authors: Wei Cao, Ping Yu Jiang
Micro-Electronic Packaging Technology and Equipment
Abstract:When the idea of service has redefined the way that a warehouse is operated and facilitated the emergence of public warehouse as a new...
1755
Authors: Lian Hu Xu, Yi Bao Yuan, Wei Ying Piao
Micro-Electronic Packaging Technology and Equipment
Abstract:The electronic or pneumatic multi-section and multi-probe gauges are widely used for diameter and coaxiality measurements due to their high...
1759
Authors: Ping Li, Qing Lei Zhou, Yang Liu, Dong Ming Zhao
Micro-Electronic Packaging Technology and Equipment
Abstract:The paper presents a contactless mobile payment method based on security TF card and NFC technology, with which we can use the security TF...
1769
Showing 331 to 340 of 484 Paper Titles