Paper Title:
Nonlinear Analysis of a Ball Grid Array Package under Thermal Cycles
  Abstract

In this study, the stress-strain distributions and interface failure in a BGA (Ball Grid Array) package subjected to thermal cycling were investigated using 2D and 3D finite element analyses. The viscous behavior of the adhesive material and thermal mismatch between the dissimilar materials in the package were considered. The potential failure sites in the solider and adhesive joints were analyzed.

  Info
Periodical
Edited by
John Bell, Cheng Yan, Lin Ye and Liangchi Zhang
Pages
57-60
DOI
10.4028/www.scientific.net/AMR.32.57
Citation
R. X. Bai, H. Jiang, C. Yan, "Nonlinear Analysis of a Ball Grid Array Package under Thermal Cycles", Advanced Materials Research, Vol. 32, pp. 57-60, 2008
Online since
February 2008
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Price
$32.00
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