Nonlinear Analysis of a Ball Grid Array Package under Thermal Cycles |
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| Journal | Advanced Materials Research (Volume 32) |
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| Volume | Frontiers in Materials Science and Technology |
| Edited by | John Bell, Cheng Yan, Lin Ye and Liangchi Zhang |
| Pages | 57-60 |
| DOI | 10.4028/www.scientific.net/AMR.32.57 |
| Citation | Rui Xiang Bai et al., 2008, Advanced Materials Research, 32, 57 |
| Online since | February, 2008 |
| Authors | Rui Xiang Bai, H. Jiang, Cheng Yan |
| Keywords | Adhesive Joint, Interface, Microelectronic Package, Solder Joint, Thermal Cycle |
| Abstract | In this study, the stress-strain distributions and interface failure in a BGA (Ball Grid Array) package subjected to thermal cycling were investigated using 2D and 3D finite element analyses. The viscous behavior of the adhesive material and thermal mismatch between the dissimilar materials in the package were considered. The potential failure sites in the solider and adhesive joints were analyzed. |
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