Paper Title:
Residual Stress Estimation of Tungsten Film by GIXRD
  Abstract

Subsurface residual stresses of tungsten films induced by Chemical Mechanical Polishing (CMP) processes were investigated by the Grazing Incident X-Ray Diffraction (GIXRD). Basis of the GIXRD measurement was introduced and the experiments were conducted for residual stress of tungsten film measurements. Experimental procedures of the GIXRD measurements were presented. The obtained residual stresses value of tungsten films from 800 nm to 400 nm varies from 1086.1 ± 105.2 MPa to 1670.6±103.4 MPa prior and after CMP process.

  Info
Periodical
Edited by
John Bell, Cheng Yan, Lin Ye and Liangchi Zhang
Pages
75-78
DOI
10.4028/www.scientific.net/AMR.32.75
Citation
C. C. A. Chen, W. E. Fu, M. K. Chen, "Residual Stress Estimation of Tungsten Film by GIXRD", Advanced Materials Research, Vol. 32, pp. 75-78, 2008
Online since
February 2008
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