Paper Title:

Bonding of Aluminum Alloy by Hot-Dipping Tin Coating

Periodical Advanced Materials Research (Volume 32)
Main Theme Frontiers in Materials Science and Technology
Edited by John Bell, Cheng Yan, Lin Ye and Liangchi Zhang
Pages 93-98
DOI 10.4028/www.scientific.net/AMR.32.93
Citation Hui Diao et al., 2008, Advanced Materials Research, 32, 93
Online since February, 2008
Authors Hui Diao, Chun Qing Wang, Lei Wang
Keywords Hot-Dipping, Intermetallic Compound (IMC), Soldering
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Abstract

This paper presents bonding technology of aluminum alloy by hot-dipping tin. The dissolution curve of copper in molten tin liquid was obtained in the experiment of hot-dipping Sn. Optimal hot-dipping parameter which was suitable for soldering was designed. To elucidate characteristics of interfacial evolution, the microstructure of the coatings, soldered joint were analyzed using optical microscopy, SEM and EDX. The shear strength of soldered joints was tested as high as 39.9Mpa, which is high enough to achieve the requirement of electronic industry.