Paper Title:
Bonding of Aluminum Alloy by Hot-Dipping Tin Coating
  Abstract

This paper presents bonding technology of aluminum alloy by hot-dipping tin. The dissolution curve of copper in molten tin liquid was obtained in the experiment of hot-dipping Sn. Optimal hot-dipping parameter which was suitable for soldering was designed. To elucidate characteristics of interfacial evolution, the microstructure of the coatings, soldered joint were analyzed using optical microscopy, SEM and EDX. The shear strength of soldered joints was tested as high as 39.9Mpa, which is high enough to achieve the requirement of electronic industry.

  Info
Periodical
Edited by
John Bell, Cheng Yan, Lin Ye and Liangchi Zhang
Pages
93-98
DOI
10.4028/www.scientific.net/AMR.32.93
Citation
H. Diao, C. Q. Wang, L. Wang, "Bonding of Aluminum Alloy by Hot-Dipping Tin Coating", Advanced Materials Research, Vol. 32, pp. 93-98, 2008
Online since
February 2008
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