Paper Title:
Solder Selection of Lead-Free Reflow Soldering and Optimization of Craft Curve
  Abstract

Lead-free reflow soldering craft is the most important solder craft in surface mount technology at present. However, the great reduction of crafting window brings challenges to the soldering quality and also poses higher requirement for the stability and reliability of lead-free soldering equipment. This article analyzes problems out of lead-free process, introduces the selecting principle of lead-free solder and analyzes the optimizing gist of temperature curve of lead-free reflow soldering.

  Info
Periodical
Chapter
Chapter 1: Manufacturing Technology and Applications
Edited by
Yuhang Yang and Yan Ma
Pages
70-74
DOI
10.4028/www.scientific.net/AMR.323.70
Citation
W. G. Wang, Y. Peng, "Solder Selection of Lead-Free Reflow Soldering and Optimization of Craft Curve", Advanced Materials Research, Vol. 323, pp. 70-74, 2011
Online since
August 2011
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Price
$32.00
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