Paper Title:
Genesis Analysis of Common Defects of Reflow Soldering and Research for Solutions
  Abstract

To guarantee the quality of surface mounting electronic products, this article analyzes the process features of its four working zones, discusses some main factors which influences the soldering quality of reflow soldering, analyzes the common soldering defects and their causes according to the temperature and process features of reflow soldering during the process of reflow soldering like row-up, bridging, wicking and solder balling. By these measurements, appearance frequency of reflow soldering is effectively reduced and quality of surface mounting electronic products is also raised.

  Info
Periodical
Chapter
Chapter 1: Manufacturing Technology and Applications
Edited by
Yuhang Yang and Yan Ma
Pages
79-83
DOI
10.4028/www.scientific.net/AMR.323.79
Citation
Y. Peng, W. G. Wang, X. P. Wang, "Genesis Analysis of Common Defects of Reflow Soldering and Research for Solutions", Advanced Materials Research, Vol. 323, pp. 79-83, 2011
Online since
August 2011
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Price
$32.00
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