Paper Title:
Key Parameter Optimization in Wave Soldering
  Abstract

Wave soldering is mainly used in electronic assembling process of traditional through-hole cartridge printed-circuit board and hybrid packaged process combining surface mounting with through-hole cartridge components. Compared with manual welding, wave soldering has advantages of high productive efficiency, good welding quality and high reliability. Wave soldering process is a complex and systematic project. During the practical productive process, flux coating quantity, preheat temperature of printed board, soldering temperature and time, uphill height of printed board and peak height should be strictly controlled and its process parameter should be comprehensively regulated in order to achieve better soldering quality.

  Info
Periodical
Chapter
Chapter 1: Manufacturing Technology and Applications
Edited by
Yuhang Yang and Yan Ma
Pages
84-88
DOI
10.4028/www.scientific.net/AMR.323.84
Citation
W. G. Wang, Y. Peng, X. P. Wang, "Key Parameter Optimization in Wave Soldering", Advanced Materials Research, Vol. 323, pp. 84-88, 2011
Online since
August 2011
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Price
$32.00
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