Paper Title:
Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process
  Abstract

Bonding of high purity polished copper was investigated using the Spark Plasma Sintering technique (SPS) showing the effect of SPS parameters (surface roughness, time, temperature and pressure) on the bonding strength behaviour. Mechanical characterization of the bonded samples was performed at room temperature using tensile test. Two surfaces roughnesses were studied (un-polished and polished samples). It was found that the bonding strength varied from 50 MPa to 233 MPa for un-polished and polished surfaces respectively The tensile strength of the used bulk copper-rod was found to be 365 MPa, while most results are over 122 MPa (a third of the bulk value).

  Info
Periodical
Chapter
Chapter II: Characterizations Techniques and Properties
Edited by
Maher Soueidan, Mohamad Roumié and Pierre Masri
Pages
177-180
DOI
10.4028/www.scientific.net/AMR.324.177
Citation
B. Mouawad, M. Soueidan, D. Fabrègue, C. Buttay, V. Bley, B. Allard, "Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process", Advanced Materials Research, Vol. 324, pp. 177-180, 2011
Online since
August 2011
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Price
$32.00
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