Paper Title:
Characterization and Aging Test Methodology for Power Electronic Devices at High Temperature
  Abstract

Power electronic modules are key elements in the chain of power conversion. The application areas include aerospace, aviation, railway, electrical distribution, automotive, home automation, oil industry ... But the use of power electronics in high temperature environments is a major strategic issue in the coming years especially in transport. However, the active components based on silicon are limited in their applications and not suitable for those require both high voltages and high ambient temperatures. The materials with wide energy gap like SiC, GaN and diamond, have the advantage of being able to exceed these limits [1,2]. These materials seem adequate to extremely harsh temperature environments and allow the reduction of cooling systems, but also the increasing of switching frequency.

  Info
Periodical
Chapter
Chapter III: Applications
Edited by
Maher Soueidan, Mohamad Roumié and Pierre Masri
Pages
411-414
DOI
10.4028/www.scientific.net/AMR.324.411
Citation
A. Ibrahim, Z. Khatir, L. Dupont, "Characterization and Aging Test Methodology for Power Electronic Devices at High Temperature", Advanced Materials Research, Vol. 324, pp. 411-414, 2011
Online since
August 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Jian Zhang Li, Li Tong Zhang, Lai Fei Cheng, Yong Dong Xu, Sheng Ru Qiao, Gui Qiong Jiao, Jun Zhang, Xin Gang Luan
Abstract:Materials characterization is a crucial issue in the development and application of new materials. Materials characterization aims to mine...
31
Authors: Marcelino Sanchez, Enric Mateu, David Perez, Pierre García, Francisco Villuendas, Carlos Heras, Rafael Alonso
Abstract:Concentrating Solar Power Technology (CSP) is nowadays growing mainly due to the technical and economic success of the first projects and to...
313
Authors: Ting Zhang, Jian Shi
Chapter 2: Advanced Design Science (1)
Abstract:Not all of the measurement data of IC (Integrated Circuit) reference material are valid, so some work would be do to eliminate the null and...
735
Authors: Muhammad Nawaz, Filippo Chimento
Chapter 10: Device and Application
Abstract:This paper addresses and evaluates the temperature dependence performance of silicon carbide (4H-SiC) based insulated gate bipolar...
1085
Authors: Kalyan Yoti Mitra, Enrico Sowade, Christoph Sternkiker, Carme Martínez-Domingo, Eloi Ramon, Jordi Carrabina, Reinhard R. Baumann
Abstract:One of the greatest challenges in the field of printed electronics is the performance stability of the devices fabricated by the different...
129