Paper Title:
Low-Temperature Joining Technique as Interconnection Technology for Power Electronics
  Abstract

There is a demand for higher junction temperatures in power devices, but the existing packaging technology is limiting the power cycling capability if the junction temperature is increased. Limiting factors are solder interconnections and bond wires. With Replacing the chip-substrate soldering by low temperature joining technique, the power cycling capability of power modules can be increased widely. Replacing also the bond wires and using a double-sided low temperature joining technique, a further significant increase in the life-time of power devices is achieved.

  Info
Periodical
Chapter
Chapter III: Applications
Edited by
Maher Soueidan, Mohamad Roumié and Pierre Masri
Pages
437-440
DOI
10.4028/www.scientific.net/AMR.324.437
Citation
R. Amro, "Low-Temperature Joining Technique as Interconnection Technology for Power Electronics", Advanced Materials Research, Vol. 324, pp. 437-440, 2011
Online since
August 2011
Authors
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Price
$32.00
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