Paper Title:
Investigation of a Polishing Pad and a Carrier Film for Decreasing Edge Roll Off of Workpiece
  Abstract

Demand for diminishing edge roll off of workpiece has rapidly increased, especially in polishing silicon wafers and glass disks. However, the conventional polishing technologies cannot meet the demand. To address this problem, the influence of carrier film properties and that of polishing pad properties on the stress distribution near the workpiece edge were investigated using finite element methods. Based on the analytical results, double-layered polishing pads having an extra-fine fiber thin layer and a hard polymer layer were developed. Polishing experiments on silicon wafers and glass plates showed that the developed polishing pads achieved high finishing efficiency and extremely flat surface near the edge.

  Info
Periodical
Chapter
Chapter 3: Polishing and Lapping
Edited by
Taghi Tawakoli
Pages
476-481
DOI
10.4028/www.scientific.net/AMR.325.476
Citation
U. Satake, W. X. Wang, T. Enomoto, N. Tabata, "Investigation of a Polishing Pad and a Carrier Film for Decreasing Edge Roll Off of Workpiece", Advanced Materials Research, Vol. 325, pp. 476-481, 2011
Online since
August 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Komgrit Lawanwong
Abstract:Bending process is an important process in the metal sheet forming in many industries. The main problem of the bending process is the...
2864
Authors: Chong Lue Hua, Gui Cheng Wang, Hong Jie Pei, Gang Liu
Chapter 8: Modeling, Analysis, and Simulation of Manufacturing Processes
Abstract:Thermal stresses of grinding plays an important role on the fatigue and wear resistance of the component. A comprehensive analysis of thermal...
2211
Authors: Chi Li, Jing Jing Zhang, Li Ping Gao
Chapter 6: Road and Railway Engineering
Abstract:Based on the typical Pavement-Subgrade structure form of western expressways, the interaction of the Pavement-subgrade system under vehicle...
1435
Authors: Yan Li, Ming Sun, Yu Ling Liu, Ao Chen Wang, Ji Ying Tang, Shi Yan Fan
Chapter 2: Micro/Nanofluids Research and Technologies
Abstract:According to the Bernoulli equation and Darcy formula, the flow model of slurry in micro-channels was established, it indicated that slurry...
462
Authors: Min Li, Bing Hai Lyu, Ju Long Yuan, Ping Zhao
Chapter 7: Finishing, Lapping and Polishing
Abstract:Shear-thickening polishing (STP) technology was used on ultraprecision machining of Si3N4 ceramics. The STP slurry with...
490