Demand for diminishing edge roll off of workpiece has rapidly increased, especially in polishing silicon wafers and glass disks. However, the conventional polishing technologies cannot meet the demand. To address this problem, the influence of carrier film properties and that of polishing pad properties on the stress distribution near the workpiece edge were investigated using finite element methods. Based on the analytical results, double-layered polishing pads having an extra-fine fiber thin layer and a hard polymer layer were developed. Polishing experiments on silicon wafers and glass plates showed that the developed polishing pads achieved high finishing efficiency and extremely flat surface near the edge.