Paper Title:
Spectroscopic Measurements of Silicon Wafer Thickness for Backgrinding Process
  Abstract

The optical microgauge system by means of near-infrared spectroscopic measurements was proposed as the thickness monitoring tool in the silicon wafer thinning process. The Fabry-Pelot interferometry and Beer’s law were employed as the principles of the system for extracting the wafer thickness from optical spectroscopic system prototyped in this study. The specifications of the system such as the thickness range and resolution were examined on the prototyped system. The filed test verified the developed system available of monitoring Si wafer as thin as 5 mm.

  Info
Periodical
Chapter
Chapter 7: Machining of Silicon-Wafer and Glass
Edited by
Taghi Tawakoli
Pages
672-677
DOI
10.4028/www.scientific.net/AMR.325.672
Citation
T. Onuki, N. Takagi, J. Shimizu, H. Ojima, L. B. Zhou, "Spectroscopic Measurements of Silicon Wafer Thickness for Backgrinding Process", Advanced Materials Research, Vol. 325, pp. 672-677, 2011
Online since
August 2011
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