Paper Title:
On the Reliability of Nanoindentation on Si Wafer at Elevated Temperatures
  Abstract

The papers has been removed as the papers has been commercially missused and is in fact being exploited in the commercial arena.

  Info
Periodical
Edited by
Taghi Tawakoli
Pages
684-689
DOI
10.4028/www.scientific.net/AMR.325.684
Online since
August 2011
Export
Price
$32.00

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