Enhanced Dielectric Response in Polyurethane Based All-Organic Nanocomposite
| Periodical | Advanced Materials Research (Volume 326) |
|---|---|
| Main Theme | Advanced Materials for Applied Science and Technology |
| Edited by | Arshad Munir and Zaffar M. Khan |
| Pages | 73-80 |
| DOI | 10.4028/www.scientific.net/AMR.326.73 |
| Citation | Jing Wen Wang et al., 2011, Advanced Materials Research, 326, 73 |
| Online since | September, 2011 |
| Authors | Jing Wen Wang, Tao Chen, Nan Wei, Cong Cong Wu, Shu Qin Li |
| Keywords | Dielectric Response, Nanocomposite, Polyurethane |
| Price | US$ 28,- |
A high dielectric constant nano-composite was fabricated using polyurethane (PU) as matrix and poly (p-chloromethyl styrene) (PCMS) grafted with copper phthalocyanine oligomer (CuPc, a planar multiring semiconductor with dielectric constant>105) (name the grafting product as PCMS-g-CuPc) as filler. According to the TEM-observed morphologies, PCMS-g-CuPc balls (~80 nm) distribute uniformly in PU matrix, while in PCMS-g-CuPc balls the PCMS acts as “matrix” which contains dispersed CuPc particles with a average size of ca. 25nm [1/20 of that of CuPc in simple blend of PU and CuPc (PU/CuPc)]. At 100Hz, the dielectric constant of the nanocomposite reaches 345, almost 7 times higher than that of PU/CuPc. The enhanced dielectric response in the nano-composite can be explained by the remarkably strengthened interface exchange coupling effect as well as the Maxwell-Wagner-Sillars polarization mechanism due to the significantly reduced CuPc particle size in the nano-composite.
