Paper Title:
A Method of MEMS Package Using Local Laser Bonding
  Abstract

The negative effect of the conventional laser bonding caused by high temperature has been analyzed in the Si-glass bonding process. A new method which is the combination of chip surface activated pre-bonding and laser bonding has been proposed. The method has been used for Micro Electro Mechanical System package experiment. The process is: firstly, a hydrophilic surface was formed by using a special chemical method. Secondly, Si and glass were pre-bonded at room temperature. Finally, the laser with the wavelength of 1.070 μm, spot diameter of 480 μm, power of 70 W was local heated by the laser. This method achieves low-temperature bonding without external press. And the tensile test also shows that the strength of sample bonding reaches 2.8 MPa~3.2 MPa. So it not only ensures the quality of MEMS chip, but also reduces the cost of the package.

  Info
Periodical
Advanced Materials Research (Volumes 328-330)
Chapter
Chapter 2: Material Science and Technology
Edited by
Liangchi Zhang, Chunliang Zhang and Zichen Chen
Pages
1313-1316
DOI
10.4028/www.scientific.net/AMR.328-330.1313
Citation
L. Cheng, Y. X. Zhang, J. Xu, M. Yan, "A Method of MEMS Package Using Local Laser Bonding", Advanced Materials Research, Vols. 328-330, pp. 1313-1316, 2011
Online since
September 2011
Export
Price
$32.00
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