Paper Title:
Determination of Residual Stress of Hard Film/Soft Substrate Specimens via Unloading Results of Nanoindentation Tests
  Abstract

A method used to determine the residual stress in a hard film deposited on a soft substrate via the unloading load-depth curves was proposed. The unloading curves with transitional behaviors were used to determine the film deflection stiffness, and then the residual stresses were obtained. Significant extra stresses were induced by a cube corner indenter at large depth. In contrast, the indentation-induced stresses could be neglected in cases of Berkovich indentation at relatively small depths.

  Info
Periodical
Advanced Materials Research (Volumes 328-330)
Chapter
Chapter 2: Material Science and Technology
Edited by
Liangchi Zhang, Chunliang Zhang and Zichen Chen
Pages
843-848
DOI
10.4028/www.scientific.net/AMR.328-330.843
Citation
H. H. Nguyen, P. J. Wei, J. F. Lin, "Determination of Residual Stress of Hard Film/Soft Substrate Specimens via Unloading Results of Nanoindentation Tests", Advanced Materials Research, Vols. 328-330, pp. 843-848, 2011
Online since
September 2011
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Price
$32.00
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