Paper Title:
Package Warpage and Stress Evaluation for a Plastic Electronic Package
  Abstract

The assembly of plastic electronic package requires a sequence of process steps. Every process step induces thermal residual deformation and stresses on the assembled components, which cause mechanical effects on the subsequent process step. In this study, both processing and non-processing models with and without considering the effect of chemical shrinkage on molding compound are built to simulate the package warpage and stresses in assembly. The processing model, a nonlinear model with element birth and death used to activate and deactivate the processing materials, can more realistically simulate a series of assembly processes in a plastic package. Due to negligence of the intermediate step, the package warpage and stresses predicted by non-processing model are in significant error.

  Info
Periodical
Advanced Materials Research (Volumes 33-37)
Edited by
Wei Yang, Mamtimin Geni, Tiejun Wang and Zhuo Zhuang
Pages
1327-1332
DOI
10.4028/www.scientific.net/AMR.33-37.1327
Citation
C. L. Chang, C. H. Chiou, "Package Warpage and Stress Evaluation for a Plastic Electronic Package", Advanced Materials Research, Vols. 33-37, pp. 1327-1332, 2008
Online since
March 2008
Export
Price
$32.00
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