Paper Title:
Effect of Microelements on Sn-20Bi Solder
  Abstract

Adding microelements Ag In Ga and Sb into Sn-20Bi solder, the changes of melting properties and microstructures of the solder were observed. The experimental result showed that when the content of Ag was 0.7% (wt%), In was 0.1% , Ga was 0.5% and Sb was 0.5%, the melting points of the solder reduced to the bottom and the segregation of Bi obviously decreased. Sb was not suitable to add solely but when it was added together with Ag In and Ga, it can produce a good effect on reinforcement of solid solution, furthermore it can restrain the phase change of Sn. The Sn-Bi-X solder with the best compositions of Ag In Ga and Sb has a near melting point to Sn-37Pb. The solder is close to practicality without segregation of Bi.

  Info
Periodical
Advanced Materials Research (Volumes 335-336)
Chapter
Chapter 1: Composites
Edited by
Yun-Hae Kim, Prasad Yarlagadda, Xiaodong Zhang and Zhijiu Ai
Pages
207-211
DOI
10.4028/www.scientific.net/AMR.335-336.207
Citation
Y. S. Li, Y. F. Luo, X. Chen, "Effect of Microelements on Sn-20Bi Solder", Advanced Materials Research, Vols. 335-336, pp. 207-211, 2011
Online since
September 2011
Export
Price
$32.00
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