Paper Title:
Multi-Physics Simulation of Amorphous Silicon Thin-Film Deposition in Plasma Enhanced Chemical Vapor Reactors
  Abstract

Two-dimensional simulation in Plasma Enhanced Chemical Vapor Deposition (PECVD) is conducted by using multi-physics analysis method. Simulation results show the growth process of amorphous silicon thin film in the PECVD reactor. The effect of process parameters (such as power supply power, electrode spacing, etc.) on the deposition rate and electric field strength is obtained, and the optimum conditions needed for growth of amorphous silicon thin film is achieved as well. It was experimentally proved that the simulation results are consistent with the experimental results, and provide a theoretical basis for adjusting and optimizing the film preparation process.

  Info
Periodical
Chapter
Chapter 2: Modeling, Analysis and Simulation of Manufacturing Processes
Edited by
Prasad Yarlagadda, Yun-Hae Kim, Zhijiu Ai and Xiaodong Zhang
Pages
266-269
DOI
10.4028/www.scientific.net/AMR.337.266
Citation
L. X. Lu, G. Q. Li, G. J. Jin, Y. Sun, "Multi-Physics Simulation of Amorphous Silicon Thin-Film Deposition in Plasma Enhanced Chemical Vapor Reactors", Advanced Materials Research, Vol. 337, pp. 266-269, 2011
Online since
September 2011
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Price
$32.00
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