Paper Title:
The Frontier Analysis of RCS for Micro-Nano Particle
  Abstract

By the method of adding MNP (micron or nano particles) into general solder, the composite electronic solder can be prepared, due to its role of solution or dispersion strengthening, and can improve the thermostable fatigue and creep properties of solder joint, it is also usually named as RCS (reinforced composite solder).Based on researchful analysis of RCS, such as metal particles, particles for high hardness, particles for low expansion coefficient, rare-earth particles and low aggregated particle, and of their reinforced mechanism, the technical requirements of RCS is found, it is also analyzed problems and application prospects of RCS.

  Info
Periodical
Chapter
Chapter 3: Materials Forming/Machining/Joining
Edited by
Prasad Yarlagadda, Yun-Hae Kim, Zhijiu Ai and Xiaodong Zhang
Pages
526-531
DOI
10.4028/www.scientific.net/AMR.337.526
Citation
C. H. Du, Z. K. Li, B. Liu, C. T. Li, "The Frontier Analysis of RCS for Micro-Nano Particle", Advanced Materials Research, Vol. 337, pp. 526-531, 2011
Online since
September 2011
Export
Price
$32.00
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