Paper Title:
Effects of Different Fluxes on the Spreadability of Zn-20Sn Solders
  Abstract

The spreadability of Zn-20Sn solders on Cu substrate was researched by using self-made flux, silver brazing 102 and medium activity rosin (RMA), and the characteristics of intermetallic compounds the appearance of solder joints were compared and analyzed at soldering joints. Results indicated that Zn-20Sn solders exhibited excellent spreadability by using self-made flux. A shoot IMC layer was closed to the solder while a flat IMC layer was presenting adjacent to the Cu substrate and the middle layer. Moreover, the characteristics of IMC and the appearances of soldered joints varied by using different fluxes.

  Info
Periodical
Chapter
Chapter 3: Materials Forming/Machining/Joining
Edited by
Prasad Yarlagadda, Yun-Hae Kim, Zhijiu Ai and Xiaodong Zhang
Pages
546-549
DOI
10.4028/www.scientific.net/AMR.337.546
Citation
Y. Y. Sheng, Y. F. Yan, K. L. Zhao, Z. W. Xu, "Effects of Different Fluxes on the Spreadability of Zn-20Sn Solders", Advanced Materials Research, Vol. 337, pp. 546-549, 2011
Online since
September 2011
Export
Price
$32.00
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