Paper Title:
PCB Related Failures in Electronic Assemblies
  Abstract

The complexity of Printed Circuit Boards (PCBs) has increased dramatically over the last three decades with the development of surface mount technology (SMT). The typical manufacture of rigid multilayer PCB contains many process procedures, which makes manufacture and application much more challenges. This paper focuses on some typical PCB related failures. Recommendations are provided on optimizing PCB manufacture process and material application. Microvia crack, black pad, galvanic attack, pad design, conductive anodic filament and pad crater are presented in detail.

  Info
Periodical
Advanced Materials Research (Volumes 341-342)
Edited by
Liu Guiping
Pages
411-415
DOI
10.4028/www.scientific.net/AMR.341-342.411
Citation
P. Liu, X. L. Gu, X. B. Zhao, X. G. Liu, "PCB Related Failures in Electronic Assemblies", Advanced Materials Research, Vols. 341-342, pp. 411-415, 2012
Online since
September 2011
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