Paper Title:
Failure on Multilayered Anisotropic Conductive Films (ACF) Packaging
  Abstract

This paper develops a computational model for predicting the failure probability of multilayered packages fabricated using anisotropic conductive film (ACF). The ACF and NCA are stacked layers by layers, and spaced with each other. The analyzed pads array 10x10 combined with specified geometry parameters in the IC/ Substrate are used to analyze the failure probability. The computational results indicate that the multilayered analysis developed in this study can provide lower failure probability by means of reducing bridging effects for improving the ACF packaging yield.

  Info
Periodical
Advanced Materials Research (Volumes 341-342)
Edited by
Liu Guiping
Pages
68-72
DOI
10.4028/www.scientific.net/AMR.341-342.68
Citation
C. M. Lin, T. C. Lin, L. M. Chu, "Failure on Multilayered Anisotropic Conductive Films (ACF) Packaging", Advanced Materials Research, Vols. 341-342, pp. 68-72, 2012
Online since
September 2011
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Price
$32.00
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