Paper Title:
Simulation for Microwave Nondestructive Detection of Thickness and Delamination in Layered-Dielectric in Metallic Substrate
  Abstract

Microwaves penetrate inside of low loss dielectric materials and they are sensitive to the presence of internal interfaces and non-uniformities. This allows microwave nondestructive inspection techniques to be utilized for inspecting dielectric in metallic substrate. This article simulated Microwave inspecting thickness and delamination in layered-dielectric in metallic substrate, using open-ended rectangular waveguide probe. Effective reflection coefficient of microwave is used in the detection and evaluation to thickness or delimination in the media. This paper optimized the detection frequency and standoff, which provide a reference for the experimental study.

  Info
Periodical
Chapter
Chapter 3: Advanced Test and Measurement
Edited by
Wensong Hu
Pages
764-771
DOI
10.4028/www.scientific.net/AMR.346.764
Citation
Y. E. Yang, C. F. He, B. Wu, "Simulation for Microwave Nondestructive Detection of Thickness and Delamination in Layered-Dielectric in Metallic Substrate", Advanced Materials Research, Vol. 346, pp. 764-771, 2012
Online since
September 2011
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Price
$32.00
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