Paper Title:
Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Excursion
  Abstract

The solder joints of surface mount components (SMCs) experience thermal degradation culminating in creep and plastic shear strain deformation when subjected to cyclic temperature load over time. Degradation at the joints is due to thermal stress induced by the incompatible, differential and nonlinear expansion mismatch of the different bonded materials in the assembly. The stress magnitude influences the strain behaviour. Plastic strain response of solder joint is critical at the materials interface at the lower part of the joint due to the occurrence of wider variation in the coefficient of thermal expansion of the bonded materials and this may lead to static structural failure. The life expectancy of electronic components reduces exponentially as the operating temperature increases thus making reliability a key concern for electronic systems operating at high temperatures and in harsh environments. This paper reports on the numerical investigation of thermo-mechanical response of a critical BGA joint especially the character of plastic deformation of SnPb solder used in forming the joint as well as the joint’s high temperature reliability. The analysis uses a 3-D models to predict the effect of the transient thermal load on the static structural integrity of a single BGA joint. In this study, the base diameter of solder ball (interface between the PCB, copper pad and the solder) experienced higher damage than the top diameter interconnects. The paper provides a simplified methodology to study the reliability of BGA solder joint at high temperatures excursion.

  Info
Periodical
Chapter
Chapter 4: Manufacturing Systems
Edited by
A.O. Akii Ibhadode
Pages
287-292
DOI
10.4028/www.scientific.net/AMR.367.287
Citation
E.H. Amalu, N.N. Ekere, R.S. Bhatti, S. Mallik, G. Takyi, A.O. A. Ibhadode, "Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Excursion", Advanced Materials Research, Vol. 367, pp. 287-292, 2012
Online since
October 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Hsiang Chen Hsu, Wei Mao Hung
Abstract:This paper demonstrates the thermal-induced mechanical problems resulted from various temperature profiles of reliability test for a...
289
Authors: J. Gong, C. Liu, P.P. Conway, Vadim V. Silberschmidt
Abstract:SnAgCu solder is a promising lead-free material for interconnections in electronic packages. However, its melting temperature (490°K) is...
359
Authors: Ikuo Shohji, Tatsuya Kobayashi, Tomotake Tohei
Abstract:The aim of this study is to investigate the relationship between the inelastic strain range and the thermal fatigue lives of chip size...
76
Authors: Meng Kao Yeh, Chun Lin Lu
Abstract:The thermal stress and thermal fatigue life for three different microgyroscope chip models were investigated in this paper. The deformation...
622
Authors: Jia Mao, Wei Hua Zhang
Chapter 1: Materials Behavior
Abstract:Three dimensional finite element models were created utilizing APDL (ANSYS Parametric Design Language) for typical multi-chip BGAP (Ball Grid...
256