Paper Title:
Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R and D Challenges
  Abstract

The development of advanced thermal management materials for Electronic Control Unit (ECU) is the key to achieving high reliability and thus safety critical operations in areas of ECU applications such as automotives and power systems. Thermal management issues associated with the operation of ECU at elevated temperature have accounted for some of the recent reliability concerns which have culminated in current systems failures in some automobiles. As the functions of ECU in systems have increased in recent times, the number of components per unit area on its board has also risen. High board density boosts internal heat generated per unit time in ECU ambient. The generated heat induces stress and strain at the chip interconnects due to variation in the Coefficient of Thermal Expansion (CTE) and thermal conductivity of different bonded materials in the assembly. Thermal degradation could become critical and impacts device’s efficiency. The life expectancy of electronic components reduces exponentially as the operating temperature rises thus making thermal management pivotal in electronic system reliability. Since materials’ properties vary with operating condition, material performance has become a major consideration in the design of heat dissipation mechanism in ECU. The development of advanced thermal management materials and hence improving the performance of ECU requires an in-depth understanding of the complex relationship between materials’ properties and their behaviours at elevated temperatures. The paper presents an overview of thermal management materials, review trends in material and processing technology. In addition, the paper outlines the crucial challenges in materials, cost and composite formulations and the outstanding R & D issues.

  Info
Periodical
Chapter
Chapter 4: Manufacturing Systems
Edited by
A.O. Akii Ibhadode
Pages
301-307
DOI
10.4028/www.scientific.net/AMR.367.301
Citation
K.C. Otiaba, N.N. Ekere, E.H. Amalu, R.S. Bhatti, S. Mallik, "Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R and D Challenges", Advanced Materials Research, Vol. 367, pp. 301-307, 2012
Online since
October 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: F. Romero, Vicente Amigó, M.D. Salvador, A. Vicente
Abstract:Titanium metal matrix composites were produced. The powder metallurgy route applied was a conventional route consisting of blending titanium...
817
Authors: Xian Liang Zhou, Duo Sheng Li, Ai Hua Zou, Xiao Zhen Hua, Zhi Guo Ye, Qing Jun Chen
New Functional Materials
Abstract:SiCp/Al composites were fabricated by ceramic mold freedom infiltration and pressureless infiltration, respectively. The microstructure and...
658
Authors: Dong Chen, Zhe Chen, Peng Zhang, Yi Jie Zhang, Haiheng Ma, Hao Wei Wang
Chapter 5: Metal Alloy Materials
Abstract:In-situ TiB2 particles reinforced AA7055 composites were fabricated through mixed-salts route and their bending properties were...
1005
Authors: Vipin Sharma, Suresh Kumar, O.P. Pandey
Chapter 11: Tribology and Wear
Abstract:The present study aims to analyze the effect of particle size on nature of microstructural features and wear behavior of composite. Stir...
564
Authors: Zhen Chen, Ye Mao Han, Min Zhou, Rong Jin Huang, Yuan Zhou, Lai Feng Li
Abstract:In the present study, the glass microsphere dispersed Bi-Sb thermoelectric materials have been fabricated through mechanical alloying...
120