Paper Title:
Microstructural Evolution during Accumulative Roll-Bonding Process of a High Performance Copper Alloy
  Abstract

Microstructural evolution of a copper alloy processed by accumulative roll-bonding (ARB) was investigated by EBSD analysis. The grains became thinner and elongated to the rolling direction with increasing the number of ARB cycles. The subdivision of the grains to the rolling direction actively begins to occur after 5 cycles of the ARB, resulting in formation of ultrafine grains with small aspect ratio. After 8 cycles, the ultrafine grained structure with the average grain diameter of 250nm developed in almost whole regions of the sample. In addition, the fraction of high-angle grain boundaries increased with the number of ARB cycles and reached about 0.7 after 8 cycles. The texture development of the ARB processed samples was different depending on the number of ARB cycles and the positions in the thickness.

  Info
Periodical
Advanced Materials Research (Volumes 378-379)
Chapter
Chapter 6: New Materials and Composites Materials
Edited by
Brendan Gan, Yu Gan and Y. Yu
Pages
597-600
DOI
10.4028/www.scientific.net/AMR.378-379.597
Citation
S. H. Lee, D. Yoon, H. Utsunomiya, "Microstructural Evolution during Accumulative Roll-Bonding Process of a High Performance Copper Alloy", Advanced Materials Research, Vols. 378-379, pp. 597-600, 2012
Online since
October 2011
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Price
$32.00
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