Paper Title:
Failure Prevention on Application of Flexible Printed Circuits
  Abstract

With the compact nature and the high electrical-connection density, flexible printed circuits (FPC) can achieve considerable weight, space and cost savings over the use of traditional rigid printed circuit boards. In recent years, it becomes impossible without flexible printed circuit technology in electronic products especially for Flip mobile phones. Whereas, its application is not always satisfied the engineering of assembly and reliability due to the existing of mechanical stress in soldering process and service environment. In this paper, through analyzing the common failures in mass production including via interconnection, trace crack and black pad, some preventions were suggested to improve the quality and reliability at the aspect of manufacture, process, mechanical design and dynamic stress distribution philosophy.

  Info
Periodical
Advanced Materials Research (Volumes 383-390)
Chapter
Chapter 17: Manufacturing Process Planning and Scheduling
Edited by
Wu Fan
Pages
4648-4652
DOI
10.4028/www.scientific.net/AMR.383-390.4648
Citation
P. Liu, X. L. Gu, X. G. Liu, X. B. Zhao, "Failure Prevention on Application of Flexible Printed Circuits", Advanced Materials Research, Vols. 383-390, pp. 4648-4652, 2012
Online since
November 2011
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Ping Liu, Xiao Long Gu, Xin Bing Zhao, Xiao Gang Liu
Abstract:The complexity of Printed Circuit Boards (PCBs) has increased dramatically over the last three decades with the development of surface mount...
411
Authors: Xin Hong Su, Yuan Ming Chen, Wei He, Shou Xu Wang, Zhi Hua Tao
Chapter 5: Technologies and Organization of Production in Mechanical Engineering
Abstract:The trend towards portability of electronic products expands the application of rigid-flex board, which has become one of the hot spots in...
527
Authors: Zaliman Sauli, Vithyacharan Retnasamy, Fairul Afzal Ahmad Fuad, Phaklen Ehkan, Muhamad Hafiz Ab Aziz
Chapter 1: Applied Materials Engineering and Materials Processing
Abstract:This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each...
62
Authors: Zaliman Sauli, Vithyacharan Retnasamy, Uda Hashim, Rajendaran Vairavan, Aaron Koay Terr Yeow, Moganraj Palianysamy, Ramzan Mat Ayub
Chapter 1: Micro/Nano Materials and Technologies
Abstract:This paper presents the correlation between electroless process time, immersion gold process time and the bump height in electroless nickel...
88