We propose control techniques to extend the fabrication area that is the limit of traditional laser fabrication systems. The current world trend of PCB core technology development is focused on next generation semi-conductor package board and special high value-added PCB including a buildup board. Laser fabrication is necessary when the process microscopic line width and the line over the scanner area and it should be synchronized scanner-stage. This cannot be done with the current Step & Scanning method. To solve this problem synchronization of the stage and scanner was facilitated to continuously process a wide-area. The processing speed and laser fabrication quality were also improved.