Paper Title:
Design of the Liquid-Cooling System for High Power LED Modules Using Taguchi Analysis
  Abstract

To optimize thermal dissipation efficiency for cooling high power LED modules is studied and analyzed using ANSYS CFX software and Taguchi method. In liquid-cooling system, four control factors are tested and compared in order to find the best cooling arrangement that are pump flow rate, fan power, cooling liquid type and k- value of thermal compound. The experimental results show that the importance of these cooling parameters applied to high power LED module are k-value of thermal compound, fan power, liquid type and pump flow rate in sequence. For a constant heating power of 90W from an LED lighting module, an optimal thermal resistance of 0.563K/W is obtained that shows a significant improved result then the conventional LED module’s. It has high potential in future high power LED applications.

  Info
Periodical
Advanced Materials Research (Volumes 383-390)
Chapter
Chapter 26: Modeling, Analysis, and Simulation of Manufacturing Processes III
Edited by
Wu Fan
Pages
6416-6421
DOI
10.4028/www.scientific.net/AMR.383-390.6416
Citation
S. S. Hung, H. C. Chang, C. M. Liang, "Design of the Liquid-Cooling System for High Power LED Modules Using Taguchi Analysis", Advanced Materials Research, Vols. 383-390, pp. 6416-6421, 2012
Online since
November 2011
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Price
$32.00
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